Closed-loop Control in Die Bonding Systems

Closed-loop Control in Die Bonding Systems

interferometric motion feedback

The synergy between front-end and back-end miniaturization is becoming increasingly important as the semiconductor industry pushes towards higher performance and integration. While shrinking transistor sizes in front-end gets exponentially complex and expensive, back-end processes like die bonding gain relevance to achieve higher system densities and functionality. Leading-edge bonding approaches for dense stacking are key enablers for breakthroughs in quantum computing, photonics, and AI.

High precision hybrid or flip chip bonding systems are essential for these applications: They offer nanometer motion to achieve accurate interconnects between layers, thus reducing signal losses and improving power efficiency.

However, achieving this level of precision in high-throughput production systems is challenging. It requires measurement systems of highest accuracy, which enable dynamic closed-loop control at bonding speeds of up to 2 m/s. To minimize errors from mechanical drift and vibration these measurements are ideally conducted directly at the bond head.

attocube's solution

attocube´s interferometer sensor IDS3010 enables nanometer precise multi-axis measurements at short and long distances. Multiple real-time interface options allow for high bandwidth closed-loop stage control.

The miniaturized sensor heads can be easily integrated thus facilitating to measure as close as possible to the point of interest. This unique combination enables ever higher accuracy and quality in advanced bonding systems. 

 

Displacement Sensor IDS3010

displacement sensors, ids

Control Unit
  • nanometer precision & certified accuracy
  • 10 MHz measurement bandwidth
  • multiple real-time interfaces
Sensor Heads
  • miniaturized sensor heads (1.2 mm)
  • compatible with various targets and materials
  • Fabry-Pérot principle for improved thermal stability